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SK Group Chairman Chey Tae-won met with TSMC CEO C.C. Wei in Taiwan to discuss collaboration in the semiconductor sector, focusing on AI and high-bandwidth memory (HBM) technology. This meeting follows a strategic partnership established in April 2024 between SK hynix and TSMC aimed at enhancing HBM production and advanced packaging capabilities, crucial for AI hardware performance. As SK hynix strengthens its position in the AI memory market, competition with Samsung intensifies, with SK hynix expected to lead in next-generation HBM4 development.
SK Hynix is expediting the release of its next-generation AI memory chips, following a request from Nvidia CEO Jensen Huang to provide samples six months earlier than planned. This move highlights the ongoing global demand for advanced semiconductors, particularly high-bandwidth memory chips (HBM4). Huang's focus on speed has been a key factor in his leadership success, as noted by SK Group Chairman Chey Tae-won during the SK AI Summit in Seoul.
Chey Tae-won
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SK Group and TSMC explore semiconductor collaboration for AI and memory technology
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10:00 11.04.2025
sk hynix accelerates ai chip launch at nvidia's request
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10:13 04.11.2024
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